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Solder Preforms
SOLDER PREFORMS
Indium-based Solder Preforms

Indium is a malleable metal with a low melting point (157℃). With Sn, Pb, Ag etc., it can form a series low melting point eutectic solders .

PRODUCT SELECTION
DETAILED INTRODUCTION
PRODUCT LIST

Features & Benefits

·? Low melting point

·? Low vapour pressure

·? Favorable ductility and malleability

·? Good thermal fatigue properties

·? Repeatable welding and reflow soldering at low temperature is available.

·? Nice resistance in drop tests?

·? Superior thermal conductivity


Product Application

Indium has a high thermal conductivity (86W / mK at 85°C). Therefore, it is widely used in thermal management, and the heat generated by electronic components can be effectively eliminated through it.

?

·? Vacuum electronic devices packaging

·? Glass packaging

·? Ceramic packaging

·? Low-temperature superconductive device packaging

PRODUCT LIST
Solid Line
°C
Liquidus
Eutectic Alloy
Density
g/cm3
Resistivity
μΩ.m
Thermal Conductivity
W/m.K
Thermal Expansion Coefficient
10-6/℃
Tensile Strength
Mpa
/ / 60 7.88 0.522 / 22 33.44
/ / 73 7.99 / / / /
/ / 100 / / / / /
120 122 / 7.3 0.147 34 20 12
118 125 / 7.3 0.147 34 20 11.86
149 154 / 7.85 / / / /
/ / 143 7.38 0.075 73 22 5.5
/ / 157 7.31 0.072 86 29 1.88
174 185 / 8.52 0.246 29 27 28.61
175 187 / 7.25 0.176 54 28 46.88
184 210 / 8.86 0.287 22 27 32.2
197 231 / 9.3 0.331 19 26 34.48