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Solder Paste
SOLDER PASTE
Low Silver High Reliability solder paste
PRODUCT SELECTION
DETAILED INTRODUCTION
PRODUCT LIST

Features and Benefits

·  Low cost.

·  High reliability:  only 0.3% Ag in the alloy, but its joint strength performs better than SAC 305.

·  Low voiding.

·  Excellent solderability:  solve the poor solder wetting problems of some important Pb-free  components, eg. CSP, QFN etc.; Good solderability on various lead-free board / component finishes, including OSP, HASL, ENIG. 

·  Outstanding printability: long stencil life - 12 hours with continuous and consistently  printing.

·  Print speeds of up to 150mm/s , enabling a fast print cycle time and a high throughput.

·  Wide reflow profile window: reflowable in air or nitrogen, enables high quality solderability of complicated, high density PWB assemblies.

·  Excellent solder and flux cosmetics after reflow soldering.

 

Applications

PCB assembly, including smartphone, Tablet PC, motherboards,  consumer electronics, web server, Automobile electrical system, and equipments of medical, military or aerospace etc.

PRODUCT LIST
Alloy
Size
Features&Application
97Sn-0.3Ag-0.7Cu-2Bi-X Type4（38~20） Low Ag High Reliability, A replacement of SAC305 paste , Tiny pitch for home appliances, vehicle etc
97Sn-0.3Ag-0.7Cu-2Bi-X 97Sn-0.3Ag-0.7Cu-2Bi-X Halogen Free