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Solder Paste
SOLDER PASTE
Tin Lead Solder paste
PRODUCT SELECTION
DETAILED INTRODUCTION
PRODUCT LIST

Features and Benefits

·  Good fluidity, excellent solderability can be attained at small pattern of 0.3mm pitch bonding pad.

·  Stable printability with little change in viscosity when printing continuously.

·  Long Stencil Life - 12 Hours with continuous and consistently  printing.

·  Remain in the same size, shape and position  without slumping after several hours of printing.

·  Good solderbility, adequate wettability is shown on various parts.

·  Adapted to soldering equipments with different grades;  Soldering without nitrogen is available; The soderability is still good in a comparatively wide reflow temperature range, both RSS and RTS temperature setting method are available.


Applications

PCB assembly, including smartphone, Tablet PC, motherboards,  consumer electronics, web server, Automobile electrical system, and equipments of medical, military or aerospace etc.

PRODUCT LIST
Alloy
Size
Features&Application
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type3(45~25),Type4(38~20) CSP Excellent wetting properties, Heat resistance
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type3(45~25),Type4(38~20) Tiny pitch for home appliances, vehicle etc.
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type3(45~25),Type4(38~20) /
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type3(45~25);Type4(38~20) Used in semiconductor packaging
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type3(45~25);Type4(38~20) Highly active product
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type2.5(25~63);Type3(45~25);Type4(38~20) Low yellow residue,Fit for white board like LED